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Directory · Engineering design and consultancy activities n.e.c.

BONDPLAS ENGINEERING

Live · as at 16 September 2026

BONDPLAS ENGINEERING is a partnership, registered in Singapore on 13 November 2003 (22 years ago). Its registered address is 20 WOODLANDS LINK, #08-16, SINGAPORE 738733, in District 25 (Kranji, Woodgrove).

Its registered industry is engineering design and consultancy activities n.e.c. (SSIC 71129).

Its status is “Live” as at 16 September 2026.

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UEN
53008004D
Business type
Sole Proprietorship/ PartnershipPartnership
Registered on
13 November 200322 years ago
Registered industry
Engineering design and consultancy activities n.e.c.SSIC 71129
Registered address
20 WOODLANDS LINK, #08-16, SINGAPORE 738733District 25 · Kranji, Woodgrove20 Woodlands Link: 364 businesses registered here →

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